華為剛性pcb檢驗標(biāo)準(zhǔn)

1、DKBADKBA華為技術(shù)有限公司企業(yè)技術(shù)標(biāo)準(zhǔn)華為技術(shù)有限公司企業(yè)技術(shù)標(biāo)準(zhǔn)DKBA3178.12006.07DKBA3178.12006.07代替QDKBA3178.12004剛性剛性PCBPCB檢驗標(biāo)準(zhǔn)檢驗標(biāo)準(zhǔn)2006年06月29日發(fā)布2006年07月01日實施華為技術(shù)有限公司HuaweiTechnologiesCo.Ltd.版權(quán)所有侵權(quán)必究Allrightsreserved密級：秘密DKBA3178.12006.0720070727華

2、為文檔，未經(jīng)許可不得擴(kuò)散第3頁共58頁P(yáng)age3Total586.2板面..............................................................166.2.1板面污漬...................................................166.2.2水漬...................................................

3、....176.2.3異物（非導(dǎo)體）.............................................176.2.4錫渣殘留...................................................176.2.5板面余銅...................................................176.2.6劃傷擦花（Scratch）.............

4、..........................176.2.7壓痕.......................................................176.2.8凹坑(PitsVoids).......................................176.2.9露織物顯布紋(WeaveExposureWeaveTexture）................186.3次板面.......

5、.....................................................186.3.1白斑微裂紋(MeaslingCrazing)..............................186.3.2分層起泡(DelaminationBlister)............................196.3.3外來夾雜物(FeignInclusions)...................

6、..........206.3.4內(nèi)層棕化或黑化層擦傷.......................................206.4導(dǎo)線..............................................................206.4.1缺口空洞針孔.............................................206.4.2鍍層缺損................

7、...................................206.4.3開路短路..................................................216.4.4導(dǎo)線壓痕...................................................216.4.5導(dǎo)線露銅...................................................